STE EB71 Electron-beam evaporation system for various applications
Automated station for E-Beam evaporation of high-quality thin-film compositions in UHV
The System was designed in accordance with “lab to fab” approach and is intended for both intensive R&D activities and pilot production. The system design enables to integrate it into multipurpose UHV cluster process line. Maximum quantity of wafers in one process is: 3х3” or 6х2”. Wafers are installed on a spherical-profile holder, considering specific features of “lift-off” process.
• process chamber made of stainless steel with ConFlat sealing, integrated wall water cooling and dry pumping system based on powerful ion pump 500 l/sec
• contact resistance HEMTs based on GaAs/InGaAs/AlGaAs and GaN/AlGaN is 0.1÷0.25 and 0.3-0.5 Om·mm, respectively (after annealing in STE RTA100 System)