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Sub-μm Gate technology

Sub-μm Gate technology developed in "Svetlana-Rost" JSC  on SemiTEq equipment:

STE3N2 – DHFET GaN wafer growth
STE EB71 – Ti/Al/Ni/Au contact & Ni/Au gate e-Beam metallization
STE RTA100 – contacts termal annealing
STE ICPe68 – dry mesa etching
Reverse gate-source current for gate-sourcevoltage -50 V less than 10μA (Wg=100 μm)