Magnetron sputtering and resistive thermal evaporation systems are intended to obtain a wide range of multilayer coatings, such as:

- metals Cu, Cr, Ni, Ag, Al, Ti, W, V, Ta, etc.;

- resistive alloys;

- dielectrics SiO2, SiNx, TiN, LiNbO3, Ta2O3, etc.;

- ITO films, etc.

Flexible configuration and using of different sputtering sources allows to realize a projects of various types.