SemiTEq — STE MS900 Magnetron sputtering system for batch wafer processing

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STE MS900 Magnetron sputtering system for batch wafer processing

Magnetron sputtering and resistive thermal evaporation systems STE MS900 are intended for R&D as well as pilot production and ensure to obtain extremely wide range of multilayer coatings (metals, dielectrics, resistive alloys, ITO films, etc.)

Optimized STE MS900 HV evaporation chamber includes a fixed source block and a lifting top cover.

Ergonomic design is equipped with a lifting mechanism for convenient maintenance of evaporators and system of screens for collecting sputtered materials.

5×Ø200mm
6×Ø150mm
30 pcs – 60×48mm
5×Ø150mm with wafer holder overturn
24 pcs – 60×48mm with wafer holder overturn

EVAPORATION CHAMBER

5 magnetron sources with targets of up to Ø150mm or 4 magnetron sources with targets of up to Ø200mm

Witness-sample*

Flat carousel wafer holder

Wafer holder rotation up to 20rpm

Wafer heating

Ion beam source*

Resistive thermal evaporator*

Water-cooled quartz crystal thickness monitor

LOAD-LOCK CHAMBER

Wafer holders cassette for up to 5×Ø200mm or 6×Ø150mm positions

Wafer manipulator

Individual pumping system

VACUUM SYSTEM

Turbomolecular pump

Scroll forepump

PROCESS CONTROL

Process automatization

Programming and storage of technological recipes

* optional

Double-side sputtering due to 180° wafer holder overturn
Installation "through the wall" in configuration with lod-lock chamber*

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* optional